Wafer Lapping

Lapping is a mechanical process in which a pad is used with a semi-abrasive polishing liquid to remove excess silicon from a wafer substrate, often  producing a dull grey, semi-reflective finish. There are several different grit sizes of the abrasive compound, depending on the customer specification. Lapping reduces stress which can build up during ingot slicing, back grinding & other similar processes. Lapping can remove defects on the wafer front and back sides, depending on customer requirements.