Laser Cut Down & Edge Rounding
Laser Cut Down and Edge Rounding
This process allows for larger diameter wafers to be downsized to a smaller diameter, without impacting the wafer quality. The automated laser system will use the wafer flat or notch as the reference point which will maintain the same orientation after cutting. The system also incorporates a vacuum spray module during the cutting process to protect against contaminants & particles, leaving the wafer clean & free of defects. This process will maintain a diameter tolerance of 0.05mm. Following the laser cut down process, an automated edge rounding tool is used to bevel the wafer edge to meet the required Semi standard specifications.